Packaging reliability superchips

A test chip module for testing the integrity of the flp chip solder ball interconnections between chip and substrate. The interconnections, are thermally stressed through an array of individual heaters formed in a layer of chip metallurgy to provide a uniform and ubiquitous source of heat. Current i...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Blanchet, Jason E, Crain, Jr, James V, Griffin, Charles W, Stone, David B, White, Robert F
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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