Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices are described herein. In one embodiment, a set of stacked microelectronic devices includes (a) a first microelectronic die having a first side and a second side opposite the first side, (b...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Ye, Seng Kim Dalson, Chong, Chin Hui, Lee, Choon Kuan, Lee, Wang Lai, Said, Roslan Bin
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Ye, Seng Kim Dalson
Chong, Chin Hui
Lee, Choon Kuan
Lee, Wang Lai
Said, Roslan Bin
description Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices are described herein. In one embodiment, a set of stacked microelectronic devices includes (a) a first microelectronic die having a first side and a second side opposite the first side, (b) a first substrate attached to the first side of the first microelectronic die and electrically coupled to the first microelectronic die, (c) a second substrate attached to the second side of the first microelectronic die, (d) a plurality of electrical couplers attached to the second substrate, (e) a third substrate coupled to the electrical couplers, and (f) a second microelectronic die attached to the third substrate. The electrical couplers are positioned such that at least some of the electrical couplers are inboard the first microelectronic die.
format Patent
fullrecord <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_07557443</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>07557443</sourcerecordid><originalsourceid>FETCH-uspatents_grants_075574433</originalsourceid><addsrcrecordid>eNrjZMj3zUwuyk_NSU0uKcrPy0xWSEkty0xOLdZRKC5JTM5OTVHIxaUgMQ8omVqSkZ9SrJCWX6SQm5hXmpaYXFJalJmXjksbDwNrWmJOcSovlOZmUHBzDXH20C0tLkgsSc0rKY5PL0oEUQbmpqbmJibGxkQoAQA9CUTy</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices</title><source>USPTO Issued Patents</source><creator>Ye, Seng Kim Dalson ; Chong, Chin Hui ; Lee, Choon Kuan ; Lee, Wang Lai ; Said, Roslan Bin</creator><creatorcontrib>Ye, Seng Kim Dalson ; Chong, Chin Hui ; Lee, Choon Kuan ; Lee, Wang Lai ; Said, Roslan Bin ; Micron Technology, Inc</creatorcontrib><description>Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices are described herein. In one embodiment, a set of stacked microelectronic devices includes (a) a first microelectronic die having a first side and a second side opposite the first side, (b) a first substrate attached to the first side of the first microelectronic die and electrically coupled to the first microelectronic die, (c) a second substrate attached to the second side of the first microelectronic die, (d) a plurality of electrical couplers attached to the second substrate, (e) a third substrate coupled to the electrical couplers, and (f) a second microelectronic die attached to the third substrate. The electrical couplers are positioned such that at least some of the electrical couplers are inboard the first microelectronic die.</description><language>eng</language><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7557443$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,780,802,885,64039</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7557443$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Ye, Seng Kim Dalson</creatorcontrib><creatorcontrib>Chong, Chin Hui</creatorcontrib><creatorcontrib>Lee, Choon Kuan</creatorcontrib><creatorcontrib>Lee, Wang Lai</creatorcontrib><creatorcontrib>Said, Roslan Bin</creatorcontrib><creatorcontrib>Micron Technology, Inc</creatorcontrib><title>Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices</title><description>Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices are described herein. In one embodiment, a set of stacked microelectronic devices includes (a) a first microelectronic die having a first side and a second side opposite the first side, (b) a first substrate attached to the first side of the first microelectronic die and electrically coupled to the first microelectronic die, (c) a second substrate attached to the second side of the first microelectronic die, (d) a plurality of electrical couplers attached to the second substrate, (e) a third substrate coupled to the electrical couplers, and (f) a second microelectronic die attached to the third substrate. The electrical couplers are positioned such that at least some of the electrical couplers are inboard the first microelectronic die.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZMj3zUwuyk_NSU0uKcrPy0xWSEkty0xOLdZRKC5JTM5OTVHIxaUgMQ8omVqSkZ9SrJCWX6SQm5hXmpaYXFJalJmXjksbDwNrWmJOcSovlOZmUHBzDXH20C0tLkgsSc0rKY5PL0oEUQbmpqbmJibGxkQoAQA9CUTy</recordid><startdate>20090707</startdate><enddate>20090707</enddate><creator>Ye, Seng Kim Dalson</creator><creator>Chong, Chin Hui</creator><creator>Lee, Choon Kuan</creator><creator>Lee, Wang Lai</creator><creator>Said, Roslan Bin</creator><scope>EFH</scope></search><sort><creationdate>20090707</creationdate><title>Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices</title><author>Ye, Seng Kim Dalson ; Chong, Chin Hui ; Lee, Choon Kuan ; Lee, Wang Lai ; Said, Roslan Bin</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_075574433</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2009</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Ye, Seng Kim Dalson</creatorcontrib><creatorcontrib>Chong, Chin Hui</creatorcontrib><creatorcontrib>Lee, Choon Kuan</creatorcontrib><creatorcontrib>Lee, Wang Lai</creatorcontrib><creatorcontrib>Said, Roslan Bin</creatorcontrib><creatorcontrib>Micron Technology, Inc</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Ye, Seng Kim Dalson</au><au>Chong, Chin Hui</au><au>Lee, Choon Kuan</au><au>Lee, Wang Lai</au><au>Said, Roslan Bin</au><aucorp>Micron Technology, Inc</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices</title><date>2009-07-07</date><risdate>2009</risdate><abstract>Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices are described herein. In one embodiment, a set of stacked microelectronic devices includes (a) a first microelectronic die having a first side and a second side opposite the first side, (b) a first substrate attached to the first side of the first microelectronic die and electrically coupled to the first microelectronic die, (c) a second substrate attached to the second side of the first microelectronic die, (d) a plurality of electrical couplers attached to the second substrate, (e) a third substrate coupled to the electrical couplers, and (f) a second microelectronic die attached to the third substrate. The electrical couplers are positioned such that at least some of the electrical couplers are inboard the first microelectronic die.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_uspatents_grants_07557443
source USPTO Issued Patents
title Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-19T19%3A15%3A25IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Ye,%20Seng%20Kim%20Dalson&rft.aucorp=Micron%20Technology,%20Inc&rft.date=2009-07-07&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E07557443%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true