Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate

A wiring glass substrate includes a glass substrate formed of glass and having a plurality of holes formed at predetermined positions, bumps so formed as to be connected to a conductive material filling the holes and wirings formed on a surface opposite to a surface having the bumps formed thereon a...

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Bibliographische Detailangaben

Hauptverfasser:	Shiono, Osamu, Ishikawa, Takao, Namekawa, Takashi, Suzuki, Yasutaka, Naito, Takashi, Yamamoto, Hiroki, Kamoto, Daigorou, Takahashi, Ken, Segawa, Tadanori, Satoh, Toshiya, Miwa, Takao, Motowaki, Shigehisa
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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