Interconnect structure and method of fabrication of same

A damascene wire and method of forming the wire. The method including: forming a mask layer on a top surface of a dielectric layer; forming an opening in the mask layer; forming a trench in the dielectric layer where the dielectric layer is not protected by the mask layer; recessing the sidewalls of...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Yang, Chih-Chao, Clevenger, Lawrence A, Cowley, Andrew P, Dalton, Timothy J, Yoon, Meeyoung H
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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