Semiconductor apparatus and manufacturing method

Pb free solder is used in die bonding. A thermal stress reduction plate is disposed between a semiconductor chip and a die pad made of a Cu alloy. The semiconductor chip and the thermal stress reduction plate are joined and the thermal stress reduction plate and the die pad are joined by a joint mat...

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Bibliographische Detailangaben

Hauptverfasser:	Kajiwara, Ryouichi, Itou, Kazutoshi, Kagii, Hidemasa, Oka, Hiroi, Nakamura, Hiroyuki
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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