Bump formation method and bump forming apparatus for semiconductor wafer

A bump formation method and a bump forming apparatus for a semiconductor wafer are provided in which productivity when bumps are formed onto the semiconductor wafer is improved as compared with the conventional art. There are provided a bump forming head, a recognition device, and a control device....

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Narita, Shoriki, Ikeya, Masahiko, Tsuboi, Yasutaka, Mae, Takaharu, Kanayama, Shinji
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
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