Bump formation method and bump forming apparatus for semiconductor wafer

Bump formation method and bump forming apparatus for semiconductor wafer

A bump formation method and a bump forming apparatus for a semiconductor wafer are provided in which productivity when bumps are formed onto the semiconductor wafer is improved as compared with the conventional art. There are provided a bump forming head, a recognition device, and a control device....

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Hauptverfasser: Narita, Shoriki, Ikeya, Masahiko, Tsuboi, Yasutaka, Mae, Takaharu, Kanayama, Shinji
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Sprache:eng
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creator Narita, Shoriki
Ikeya, Masahiko
Tsuboi, Yasutaka
Mae, Takaharu
Kanayama, Shinji
description A bump formation method and a bump forming apparatus for a semiconductor wafer are provided in which productivity when bumps are formed onto the semiconductor wafer is improved as compared with the conventional art. There are provided a bump forming head, a recognition device, and a control device. ICs formed on the semiconductor wafer are divided into basic blocks. Bump formation is performed continuously for the ICs included in one basic block. Positional recognition for the other basic blocks is performed only when the bump formation operation is shifted from one basic block to another basic block. Thus, in comparison with the conventional art whereby a positional recognition operation is performed every time bumps are formed on each IC, the number of times of performing positional recognition is greatly reduced, so that productivity can be improved.
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title Bump formation method and bump forming apparatus for semiconductor wafer
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