Silicon wafer thinning end point method

Disclosed are a method of and system for fabricating a semiconductor wafer. The method comprises the steps of providing a silicon wafer having a front side an a back side, building an integrated circuit on the front side of the wafer, and thereafter removing substrate from the back side of the silic...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Codding, Steven R, Krywanczyk, Timothy C, Sprogis, Edmund J
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
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