Pad over active circuit system and method with frame support structure

Pad over active circuit system and method with frame support structure

An integrated circuit and method of fabricating the same are provided. Included are an active circuit, and a metal layer disposed, at least partially, above the active circuit. Further provided is a bond pad disposed, at least partially, above the metal layer. To prevent damage incurred during a bon...

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Hauptverfasser: Singh, Inderjit, Marks, Howard Lee, Greco, Joseph David
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Sprache:eng
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creator Singh, Inderjit
Marks, Howard Lee
Greco, Joseph David
description An integrated circuit and method of fabricating the same are provided. Included are an active circuit, and a metal layer disposed, at least partially, above the active circuit. Further provided is a bond pad disposed, at least partially, above the metal layer. To prevent damage incurred during a bonding process, the aforementioned metal layer may define a frame with an outer periphery and an inner periphery.
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title Pad over active circuit system and method with frame support structure
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