Wire bonding apparatus and method for clamping a wire
A controller may receive a wire disconnection signal from a wire bonding monitoring system and operate a wire clamp to clamp a disconnected wire. A series of operations, which may include a wire drawing operation, a wire tail forming operation and a ball forming operation, may be automatically perfo...
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| creator | Kim, Tae-Hyun Ko, Youn-Sung Sun, Young-Kyun Kim, Dae-Soo Oh, Kook-Jin Lee, Sang-Woo Kim, Dong-Bin |
| description | A controller may receive a wire disconnection signal from a wire bonding monitoring system and operate a wire clamp to clamp a disconnected wire. A series of operations, which may include a wire drawing operation, a wire tail forming operation and a ball forming operation, may be automatically performed. A sensor may measure the length of the wire drawn through the capillary and the location of a ball that may be formed at a wire tail. An auxiliary clamp may be installed between the wire clamp and the capillary for drawing the wire using sensor information. |
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A series of operations, which may include a wire drawing operation, a wire tail forming operation and a ball forming operation, may be automatically performed. A sensor may measure the length of the wire drawn through the capillary and the location of a ball that may be formed at a wire tail. An auxiliary clamp may be installed between the wire clamp and the capillary for drawing the wire using sensor information.</abstract><oa>free_for_read</oa></addata></record> |
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| title | Wire bonding apparatus and method for clamping a wire |
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