Leadframe enhancement and method of producing a multi-row semiconductor package

A semiconductor package includes a plurality of first leads, each with a top outer portion removed from the lead and an outer end, and a plurality of second leads, each with a bottom outer portion removed from the lead and an outer end. The first and second leads alternate with each other along an e...

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Bibliographische Detailangaben

Hauptverfasser:	Retuta, Danny Vallejo, Tan, Hien Boon, Tanary, Susanto, Sun, Anthony Yi Sheng, Tan, Soon Huat James
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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