Method to improve time dependent dielectric breakdown

Method to improve time dependent dielectric breakdown

In the back end of an integrated circuit employing dual-damascene interconnects, the interconnect members have a first non-conformal liner that has a thicker portion at the top of the trench level of the interconnect; and a conformal second liner that combines with the first liner to block diffusion...

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Hauptverfasser: Chanda, Kaushik, Demarest, James J, Filippi, Ronald G, Iggulden, Roy C, Kiewra, Edward W, McGahay, Vincent J, Wang, Ping-Chuan, Wang, Yun-Yu
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creator Chanda, Kaushik
Demarest, James J
Filippi, Ronald G
Iggulden, Roy C
Kiewra, Edward W
McGahay, Vincent J
Wang, Ping-Chuan
Wang, Yun-Yu
description In the back end of an integrated circuit employing dual-damascene interconnects, the interconnect members have a first non-conformal liner that has a thicker portion at the top of the trench level of the interconnect; and a conformal second liner that combines with the first liner to block diffusion of the metal fill material.
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title Method to improve time dependent dielectric breakdown
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