Flip chip bonding tool

A bonding tool and method for bonding a semiconductor chip to a surface is provided wherein the bonding tool includes a bonding tip comprising a ceramic material, preferably titanium carbide. The bonding tip is operative to hold the chip and a bonding energy generator such as an ultrasonic transduce...

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Bibliographische Detailangaben

Hauptverfasser:	Fu, Ran, Liu, Deming, Chaw, Chi Chuen, Li, Hing Leung, Pang, Chak Hau, Siu, Hing Suen
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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