Method and apparatus for reducing heat absorption around solder pads on an electrical lead suspension

Method and apparatus for reducing heat absorption around solder pads on an electrical lead suspension

An apparatus and method for reducing heat absorption around solder pads on an electrical lead suspension (ELS). The method provides a base-metal layer having at least one opening. A dielectric layer is also provided above the base-metal layer, the dielectric layer covering a portion of the base-meta...

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Hauptverfasser: Arya, Satya Prakash, Xing, Xinzhi
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creator Arya, Satya Prakash
Xing, Xinzhi
description An apparatus and method for reducing heat absorption around solder pads on an electrical lead suspension (ELS). The method provides a base-metal layer having at least one opening. A dielectric layer is also provided above the base-metal layer, the dielectric layer covering a portion of the base-metal layer and at least one of the openings in the base-metal layer. A signal conductive layer is provided above dielectric layer. The signal conductive layer carries at least one solder pad portion, wherein the solder pad portion is placed above the portion of the dielectric layer such that the solder pad portion does not align with the at least one opening in the base-metal layer. In so doing, the heat absorption with respect to the base-metal layer is reduced.
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fullrecord <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_07450346</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>07450346</sourcerecordid><originalsourceid>FETCH-uspatents_grants_074503463</originalsourceid><addsrcrecordid>eNqNy00KAjEMBeBuXIh6h1xAGJhRDyCKG3fuJbaZHyhJSdL72wEP4OLx4PG9baAn-SwJkFtKQUWvBqMoKKUaF55gJnTAj4kWX4QBVWrTJjmRQsFksK4MlCm6LhEzZMImqhVia5992IyYjQ6_3gW4317Xx7EJdGK396S4VncZTl0_nPs_yBfhNkA_</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method and apparatus for reducing heat absorption around solder pads on an electrical lead suspension</title><source>USPTO Issued Patents</source><creator>Arya, Satya Prakash ; Xing, Xinzhi</creator><creatorcontrib>Arya, Satya Prakash ; Xing, Xinzhi ; Hitachi Global Storage Technologies Netherlands B.V</creatorcontrib><description>An apparatus and method for reducing heat absorption around solder pads on an electrical lead suspension (ELS). The method provides a base-metal layer having at least one opening. A dielectric layer is also provided above the base-metal layer, the dielectric layer covering a portion of the base-metal layer and at least one of the openings in the base-metal layer. A signal conductive layer is provided above dielectric layer. The signal conductive layer carries at least one solder pad portion, wherein the solder pad portion is placed above the portion of the dielectric layer such that the solder pad portion does not align with the at least one opening in the base-metal layer. In so doing, the heat absorption with respect to the base-metal layer is reduced.</description><language>eng</language><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7450346$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,776,798,881,64012</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7450346$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Arya, Satya Prakash</creatorcontrib><creatorcontrib>Xing, Xinzhi</creatorcontrib><creatorcontrib>Hitachi Global Storage Technologies Netherlands B.V</creatorcontrib><title>Method and apparatus for reducing heat absorption around solder pads on an electrical lead suspension</title><description>An apparatus and method for reducing heat absorption around solder pads on an electrical lead suspension (ELS). The method provides a base-metal layer having at least one opening. A dielectric layer is also provided above the base-metal layer, the dielectric layer covering a portion of the base-metal layer and at least one of the openings in the base-metal layer. A signal conductive layer is provided above dielectric layer. The signal conductive layer carries at least one solder pad portion, wherein the solder pad portion is placed above the portion of the dielectric layer such that the solder pad portion does not align with the at least one opening in the base-metal layer. In so doing, the heat absorption with respect to the base-metal layer is reduced.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2008</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNqNy00KAjEMBeBuXIh6h1xAGJhRDyCKG3fuJbaZHyhJSdL72wEP4OLx4PG9baAn-SwJkFtKQUWvBqMoKKUaF55gJnTAj4kWX4QBVWrTJjmRQsFksK4MlCm6LhEzZMImqhVia5992IyYjQ6_3gW4317Xx7EJdGK396S4VncZTl0_nPs_yBfhNkA_</recordid><startdate>20081111</startdate><enddate>20081111</enddate><creator>Arya, Satya Prakash</creator><creator>Xing, Xinzhi</creator><scope>EFH</scope></search><sort><creationdate>20081111</creationdate><title>Method and apparatus for reducing heat absorption around solder pads on an electrical lead suspension</title><author>Arya, Satya Prakash ; Xing, Xinzhi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_074503463</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2008</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Arya, Satya Prakash</creatorcontrib><creatorcontrib>Xing, Xinzhi</creatorcontrib><creatorcontrib>Hitachi Global Storage Technologies Netherlands B.V</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Arya, Satya Prakash</au><au>Xing, Xinzhi</au><aucorp>Hitachi Global Storage Technologies Netherlands B.V</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method and apparatus for reducing heat absorption around solder pads on an electrical lead suspension</title><date>2008-11-11</date><risdate>2008</risdate><abstract>An apparatus and method for reducing heat absorption around solder pads on an electrical lead suspension (ELS). The method provides a base-metal layer having at least one opening. A dielectric layer is also provided above the base-metal layer, the dielectric layer covering a portion of the base-metal layer and at least one of the openings in the base-metal layer. A signal conductive layer is provided above dielectric layer. The signal conductive layer carries at least one solder pad portion, wherein the solder pad portion is placed above the portion of the dielectric layer such that the solder pad portion does not align with the at least one opening in the base-metal layer. In so doing, the heat absorption with respect to the base-metal layer is reduced.</abstract><oa>free_for_read</oa></addata></record>
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title Method and apparatus for reducing heat absorption around solder pads on an electrical lead suspension
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-08T10%3A47%3A25IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Arya,%20Satya%20Prakash&rft.aucorp=Hitachi%20Global%20Storage%20Technologies%20Netherlands%20B.V&rft.date=2008-11-11&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E07450346%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true