IC chip package having force-adjustable member between stiffener and printed circuit board
An IC chip package and related method are disclosed. The IC chip package may include a printed circuit board (PCB) coupled to a chip carrier by a land grid array (LGA) connector; a metal stiffener including at least one force-adjustable member contacting an underside of the PCB; and at least two cou...
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| Format: | Patent |
| Sprache: | eng |
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