Method of manufacturing resin molding and change-over device for changing over between heating medium and resin material in process of secondary forming

The change-over device changes over, to one of three passages, between the runner groove connected to the injection nozzle and the communicating groove communicated with the mold side passage. At the first position, the second passage is communicated with the communicating groove and the temperature...

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Bibliographische Detailangaben

Hauptverfasser:	Nasu, Hidehisa, Kuroyanagi, Akira, Ichikawa, Masato, Sahashi, Akira
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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