Capillary for wire bonding
A capillary tip for deforming a bonding wire during bonding of the wire to a bonding surface comprises a bottom face along an inner periphery of the capillary tip for pressing the bonding wire against a bonding surface, an outer radius along an outer periphery of the capillary tip, and includes a fi...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | Lim, Loon A Vath, III, Charles J |
| description | A capillary tip for deforming a bonding wire during bonding of the wire to a bonding surface comprises a bottom face along an inner periphery of the capillary tip for pressing the bonding wire against a bonding surface, an outer radius along an outer periphery of the capillary tip, and includes a first inclined face adjacent to the bottom face and extending obliquely to the bottom face as well as a second inclined face adjacent to the first inclined face and extending obliquely to the first inclined face. |
| format | Patent |
| fullrecord | <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_07427009</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>07427009</sourcerecordid><originalsourceid>FETCH-uspatents_grants_074270093</originalsourceid><addsrcrecordid>eNrjZJByTizIzMlJLKpUSMsvUijPLEpVSMrPS8nMS-dhYE1LzClO5YXS3AwKbq4hzh66pcUFiSWpeSXF8elFiSDKwNzEyNzAwNKYCCUAJOcjyQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Capillary for wire bonding</title><source>USPTO Issued Patents</source><creator>Lim, Loon A ; Vath, III, Charles J</creator><creatorcontrib>Lim, Loon A ; Vath, III, Charles J ; ASM Technology Singapore Pte Ltd</creatorcontrib><description>A capillary tip for deforming a bonding wire during bonding of the wire to a bonding surface comprises a bottom face along an inner periphery of the capillary tip for pressing the bonding wire against a bonding surface, an outer radius along an outer periphery of the capillary tip, and includes a first inclined face adjacent to the bottom face and extending obliquely to the bottom face as well as a second inclined face adjacent to the first inclined face and extending obliquely to the first inclined face.</description><language>eng</language><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7427009$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,777,799,882,64018</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7427009$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Lim, Loon A</creatorcontrib><creatorcontrib>Vath, III, Charles J</creatorcontrib><creatorcontrib>ASM Technology Singapore Pte Ltd</creatorcontrib><title>Capillary for wire bonding</title><description>A capillary tip for deforming a bonding wire during bonding of the wire to a bonding surface comprises a bottom face along an inner periphery of the capillary tip for pressing the bonding wire against a bonding surface, an outer radius along an outer periphery of the capillary tip, and includes a first inclined face adjacent to the bottom face and extending obliquely to the bottom face as well as a second inclined face adjacent to the first inclined face and extending obliquely to the first inclined face.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2008</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZJByTizIzMlJLKpUSMsvUijPLEpVSMrPS8nMS-dhYE1LzClO5YXS3AwKbq4hzh66pcUFiSWpeSXF8elFiSDKwNzEyNzAwNKYCCUAJOcjyQ</recordid><startdate>20080923</startdate><enddate>20080923</enddate><creator>Lim, Loon A</creator><creator>Vath, III, Charles J</creator><scope>EFH</scope></search><sort><creationdate>20080923</creationdate><title>Capillary for wire bonding</title><author>Lim, Loon A ; Vath, III, Charles J</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_074270093</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2008</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Lim, Loon A</creatorcontrib><creatorcontrib>Vath, III, Charles J</creatorcontrib><creatorcontrib>ASM Technology Singapore Pte Ltd</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Lim, Loon A</au><au>Vath, III, Charles J</au><aucorp>ASM Technology Singapore Pte Ltd</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Capillary for wire bonding</title><date>2008-09-23</date><risdate>2008</risdate><abstract>A capillary tip for deforming a bonding wire during bonding of the wire to a bonding surface comprises a bottom face along an inner periphery of the capillary tip for pressing the bonding wire against a bonding surface, an outer radius along an outer periphery of the capillary tip, and includes a first inclined face adjacent to the bottom face and extending obliquely to the bottom face as well as a second inclined face adjacent to the first inclined face and extending obliquely to the first inclined face.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_uspatents_grants_07427009 |
| source | USPTO Issued Patents |
| title | Capillary for wire bonding |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-19T15%3A55%3A58IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Lim,%20Loon%20A&rft.aucorp=ASM%20Technology%20Singapore%20Pte%20Ltd&rft.date=2008-09-23&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E07427009%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |