Integrated circuit with re-route layer and stacked die assembly

An apparatus and a method of manufacture for a stacked-die assembly. A first die is placed on a substrate such that the backside of the die, i.e., the side opposite the side with the bond pads, is coupled to the substrate, preferably by an adhesive. Wire leads electrically couple the bond pads of th...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Thomas, Jochen, Weitz, Peter, Grafe, Jurgen, Hedler, Harry, Pohl, Jens
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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