Apparatus and method for miniature semiconductor packages

A method and apparatus for making reliable miniature semiconductor packages having a reduced height and footprint is provided. The package includes a semiconductor chip having an active surface and a non-active surface and one or more contacts positioned adjacent the semiconductor chip. Electrical c...

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Bibliographische Detailangaben

Hauptverfasser:	Lee, Shaw Wei, Tu, Nghia Thuc, Nadarajah, Santhiran S/O, Soon, Lim Peng
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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