Silicon semiconductor substrate and its manufacturing method

The present invention has been made in order to manufacture a silicon semiconductor substrate used for a semiconductor integrated circuit device, higher in carrier mobility, especially in electron mobility, which is a carrier of an n-type FET, on a {100} plane as a main surface, and provides a silic...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Yamanaka, Hideki, Demizu, Kiyoshi, Ohmi, Tadahiro, Teramoto, Akinobu, Sugawa, Shigetoshi
Format: Patent
Sprache:eng
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