Interconnections for flip-chip using lead-free solders and having reaction barrier layers

An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting composition including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing le...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Fogel, Keith E, Ghosal, Balaram, Kang, Sung K, Kilpatrick, Stephen, Lauro, Paul A, Nye, III, Henry A, Shih, Da-Yuan, Zupanski-Nielsen, Donna S
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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