Interconnections for flip-chip using lead-free solders and having reaction barrier layers

Interconnections for flip-chip using lead-free solders and having reaction barrier layers

An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting composition including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing le...

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Hauptverfasser: Fogel, Keith E, Ghosal, Balaram, Kang, Sung K, Kilpatrick, Stephen, Lauro, Paul A, Nye, III, Henry A, Shih, Da-Yuan, Zupanski-Nielsen, Donna S
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Sprache:eng
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creator Fogel, Keith E
Ghosal, Balaram
Kang, Sung K
Kilpatrick, Stephen
Lauro, Paul A
Nye, III, Henry A
Shih, Da-Yuan
Zupanski-Nielsen, Donna S
description An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting composition including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components.
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title Interconnections for flip-chip using lead-free solders and having reaction barrier layers
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