Electrical interconnection for high-frequency devices

Electrical interconnection for high-frequency devices

Wire bonds connect current-carrying edges of high-frequency planar conductors to other electrical devices. In one embodiment, planar transmission lines are interconnected using two wire bonds. One bond wire extends from an edge of a first center conductor to a corresponding edge of a second center c...

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Hauptverfasser: Qin, Xiaohui, Akinwande, Deji, Stephens, James P, Zinsmaster, Robin, Clatterbaugh, Jim
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Sprache:eng
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creator Qin, Xiaohui
Akinwande, Deji
Stephens, James P
Zinsmaster, Robin
Clatterbaugh, Jim
description Wire bonds connect current-carrying edges of high-frequency planar conductors to other electrical devices. In one embodiment, planar transmission lines are interconnected using two wire bonds. One bond wire extends from an edge of a first center conductor to a corresponding edge of a second center conductor, and a second bond wire extends from the other edge of the first center conductor to the other edge of the second center conductor. Embodiments include center conductors at different heights and having different widths, and different electrical devices, such as semiconductor integrated circuits. In a particular embodiment, ball bonding is used. In some embodiments, a tack bond is included after a ball bond to allow closer attachment of the bond wire to the edge of the conductor.
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title Electrical interconnection for high-frequency devices
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