Manufacture of printed circuit boards with stubless plated through-holes

A process of copper plating a through-hole in a printed circuit board, and the printed circuit board made from such process. The process comprises: providing a printed circuit board with at least two copper interconnect lines separated by an insulator in the vertical direction; providing a through-h...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Buchwalter, Stephen L, Budd, Russell Alan
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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