Flip FERAM cell and method to form same

Flip FERAM cell and method to form same

A method of forming an integrated ferroelectric/CMOS structure which effectively separates incompatible high temperature deposition and annealing processes is provided. The method of the present invention includes separately forming a CMOS structure and a ferroelectric delivery wafer. These separate...

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Hauptverfasser: Adkisson, James W, Black, Charles Thomas, Grill, Alfred, Mann, Randy William, Neumayer, Deborah Ann, Pricer, Wilbur David, Saenger, Katherine Lynn, Shaw, Thomas McCarroll
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Sprache:eng
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creator Adkisson, James W
Black, Charles Thomas
Grill, Alfred
Mann, Randy William
Neumayer, Deborah Ann
Pricer, Wilbur David
Saenger, Katherine Lynn
Shaw, Thomas McCarroll
description A method of forming an integrated ferroelectric/CMOS structure which effectively separates incompatible high temperature deposition and annealing processes is provided. The method of the present invention includes separately forming a CMOS structure and a ferroelectric delivery wafer. These separate structures are then brought into contact with each and the ferroelectric film of the delivery wafer is bonded to the upper conductive electrode layer of the CMOS structure by using a low temperature anneal step. A portion of the delivery wafer is then removed providing an integrated FE/CMOS structure wherein the ferroelectric capacitor is formed on top of the CMOS structure. The capacitor is in contact with the transistor of the CMOS structure through all the wiring levels of the CMOS structure.
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The method of the present invention includes separately forming a CMOS structure and a ferroelectric delivery wafer. These separate structures are then brought into contact with each and the ferroelectric film of the delivery wafer is bonded to the upper conductive electrode layer of the CMOS structure by using a low temperature anneal step. A portion of the delivery wafer is then removed providing an integrated FE/CMOS structure wherein the ferroelectric capacitor is formed on top of the CMOS structure. 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title Flip FERAM cell and method to form same
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