Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore

A bump forming apparatus which carries out a temperature control of a type different from the conventional art in forming bumps to a semiconductor wafer, and a bump formation method executed by the bump forming apparatus are provided. A bonding stage, a load and transfer device and a control device...

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Bibliographische Detailangaben

Hauptverfasser:	Imanishi, Makoto, Narita, Shoriki, Ikeya, Masahiko, Kanayama, Shinji, Mae, Takaharu
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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