Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore

Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore

A bump forming apparatus which carries out a temperature control of a type different from the conventional art in forming bumps to a semiconductor wafer, and a bump formation method executed by the bump forming apparatus are provided. A bonding stage, a load and transfer device and a control device...

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Hauptverfasser: Imanishi, Makoto, Narita, Shoriki, Ikeya, Masahiko, Kanayama, Shinji, Mae, Takaharu
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Sprache:eng
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creator Imanishi, Makoto
Narita, Shoriki
Ikeya, Masahiko
Kanayama, Shinji
Mae, Takaharu
description A bump forming apparatus which carries out a temperature control of a type different from the conventional art in forming bumps to a semiconductor wafer, and a bump formation method executed by the bump forming apparatus are provided. A bonding stage, a load and transfer device and a control device are provided. A wafer, after having bumps formed thereon, is held by the load and transfer device and arranged above the bonding stage through control by the control device, so that a temperature drop of the wafer is controlled. Accordingly, generation of troubles such as a crack because of thermal stress and the like can be prevented to even compound semiconductor wafers sensitive to a temperature change.
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title Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore
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