Method and apparatus for drying a wafer, and an apparatus for cleaning and drying a wafer

A method an apparatus for drying a wafer, and an apparatus for cleaning and drying a wafer are provided. In the apparatus for cleaning and drying a wafer, the wafer is dipped into a cleaning solution in a cleaning tank. The wafer is then dried using a drying gas in a drying chamber disposed over the...

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Hauptverfasser:	Yi, Hun-Jung, Chung, Won-Young, Park, Sang-Oh, Lee, Ye-Ro
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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