Atmospheric process and system for controlled and rapid removal of polymers from high aspect ratio holes

A system that generates an intense hot gas stream is described to etch a polymer on a substrate used in the manufacture of semiconductor and MEMS devices with no surface damage. The etching process is particularly useful to remove a polymer from relatively high aspect Height-to-Width and Width-to-He...

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Bibliographische Detailangaben

Hauptverfasser:	Bollinger, Lynn David, Tokmouline, Iskander
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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