Module structure and module comprising it

A module is provided that has high reliability in the junction between a ceramic circuit board and a heat sink, undergoes small changes in shape and warp of a module structure comprising a ceramic circuit board and a metal heat sink event under a temperature history during power module assembly and...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Emoto, Hideyuki, Ibukiyama, Masahiro, Sugimoto, Isao, Uto, Manabu
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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