Upper chamber for high density plasma CVD

The present invention is directed to an upper chamber design of a plasma CVD chamber which provides more uniform conditions for forming thin CVD films on a substrate. Embodiments of the invention improve temperature control of the upper chamber and improve particle performance by reducing or minimiz...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Gondhalekar, Sudhir, Cho, Tom K, Guenther, Rolf, Kim, Steve H, Moshfegh, Mehrdad, Takehiro, Shigeru, Kring, Thomas, Ishikawa, Tetsuya
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!