Semiconductor module having an internal semiconductor chip stack, and method for producing said semiconductor module

A semiconductor module having an internal semiconductor chip stack on a wiring substrate is disclosed. In one embodiment, the semiconductor chip stack has semiconductor chips which are arranged such that they are offset, the semiconductor chips having bonding connection pads in at least one edge reg...

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Bibliographische Detailangaben

Hauptverfasser:	Grafe, Jurgen, Ludewig, Sylke, Thomas, Jochen, Weitz, Peter
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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