Providing a metal layer in a semiconductor package

In one embodiment, the present invention includes a semiconductor package having a substrate, a semiconductor die with a first surface opposing the substrate and a second surface, a metal layer formed on the second surface of the semiconductor die, and a mold layer formed on the substrate. In some e...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Khaw, Lee Peng, Chen, Chee Koang, Tan, Wooi Aun, Hin, Tze Yang
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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