Integrally packaged imaging module
An integrally packaged imaging module includes an integrated circuit (IC), including an image sensing device formed on a semiconductor substrate, and wafer level packaging enclosing the IC. The wafer level packaging includes a transparent enclosure portion adapted to permit image acquisition of an i...
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| creator | Ma, Guolin Afshari, Bahram |
| description | An integrally packaged imaging module includes an integrated circuit (IC), including an image sensing device formed on a semiconductor substrate, and wafer level packaging enclosing the IC. The wafer level packaging includes a transparent enclosure portion adapted to permit image acquisition of an image by the image sensing device over a desired range of wavelengths, and a first spacing structure providing a cavity between an inner surface of the transparent enclosure portion and the image sensing device. A depth of the cavity is configurable along an axis perpendicular to the semiconductor substrate to control a distance between an outer surface of the transparent enclosure portion and the image sensing device. |
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| fullrecord | <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_07329861</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>07329861</sourcerecordid><originalsourceid>FETCH-uspatents_grants_073298613</originalsourceid><addsrcrecordid>eNrjZFDyzCtJTS9KzMmpVChITM5OTE9NUcjMTUzPzEtXyM1PKc1J5WFgTUvMKU7lhdLcDApuriHOHrqlxQWJJal5JcXxQANAlIG5sZGlhZmhMRFKAJygJww</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Integrally packaged imaging module</title><source>USPTO Issued Patents</source><creator>Ma, Guolin ; Afshari, Bahram</creator><creatorcontrib>Ma, Guolin ; Afshari, Bahram ; Micron Technology, Inc</creatorcontrib><description>An integrally packaged imaging module includes an integrated circuit (IC), including an image sensing device formed on a semiconductor substrate, and wafer level packaging enclosing the IC. The wafer level packaging includes a transparent enclosure portion adapted to permit image acquisition of an image by the image sensing device over a desired range of wavelengths, and a first spacing structure providing a cavity between an inner surface of the transparent enclosure portion and the image sensing device. A depth of the cavity is configurable along an axis perpendicular to the semiconductor substrate to control a distance between an outer surface of the transparent enclosure portion and the image sensing device.</description><language>eng</language><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7329861$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,777,799,882,64018</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7329861$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Ma, Guolin</creatorcontrib><creatorcontrib>Afshari, Bahram</creatorcontrib><creatorcontrib>Micron Technology, Inc</creatorcontrib><title>Integrally packaged imaging module</title><description>An integrally packaged imaging module includes an integrated circuit (IC), including an image sensing device formed on a semiconductor substrate, and wafer level packaging enclosing the IC. The wafer level packaging includes a transparent enclosure portion adapted to permit image acquisition of an image by the image sensing device over a desired range of wavelengths, and a first spacing structure providing a cavity between an inner surface of the transparent enclosure portion and the image sensing device. A depth of the cavity is configurable along an axis perpendicular to the semiconductor substrate to control a distance between an outer surface of the transparent enclosure portion and the image sensing device.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2008</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZFDyzCtJTS9KzMmpVChITM5OTE9NUcjMTUzPzEtXyM1PKc1J5WFgTUvMKU7lhdLcDApuriHOHrqlxQWJJal5JcXxQANAlIG5sZGlhZmhMRFKAJygJww</recordid><startdate>20080212</startdate><enddate>20080212</enddate><creator>Ma, Guolin</creator><creator>Afshari, Bahram</creator><scope>EFH</scope></search><sort><creationdate>20080212</creationdate><title>Integrally packaged imaging module</title><author>Ma, Guolin ; Afshari, Bahram</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_073298613</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2008</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Ma, Guolin</creatorcontrib><creatorcontrib>Afshari, Bahram</creatorcontrib><creatorcontrib>Micron Technology, Inc</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Ma, Guolin</au><au>Afshari, Bahram</au><aucorp>Micron Technology, Inc</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Integrally packaged imaging module</title><date>2008-02-12</date><risdate>2008</risdate><abstract>An integrally packaged imaging module includes an integrated circuit (IC), including an image sensing device formed on a semiconductor substrate, and wafer level packaging enclosing the IC. The wafer level packaging includes a transparent enclosure portion adapted to permit image acquisition of an image by the image sensing device over a desired range of wavelengths, and a first spacing structure providing a cavity between an inner surface of the transparent enclosure portion and the image sensing device. A depth of the cavity is configurable along an axis perpendicular to the semiconductor substrate to control a distance between an outer surface of the transparent enclosure portion and the image sensing device.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
| recordid | cdi_uspatents_grants_07329861 |
| source | USPTO Issued Patents |
| title | Integrally packaged imaging module |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-20T03%3A59%3A01IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Ma,%20Guolin&rft.aucorp=Micron%20Technology,%20Inc&rft.date=2008-02-12&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E07329861%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |