Coating for enhancing adhesion of molding compound to semiconductor devices

Coating for enhancing adhesion of molding compound to semiconductor devices

A method is provided for enhancing adhesion between a molding compound and a semiconductor device comprising a semiconductor chip attached on a carrier, such as a lead frame, by coating the semiconductor device with a polymer primer prior to molding the semiconductor device. Such coating may be perf...

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Hauptverfasser: Li, Jianxiong, Chaw, Chi Chuen, Tsui, Ngai Kin, Liu, Deming, Kwan, Yiu Fai, Chan, Wai
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Sprache:eng
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creator Li, Jianxiong
Chaw, Chi Chuen
Tsui, Ngai Kin
Liu, Deming
Kwan, Yiu Fai
Chan, Wai
description A method is provided for enhancing adhesion between a molding compound and a semiconductor device comprising a semiconductor chip attached on a carrier, such as a lead frame, by coating the semiconductor device with a polymer primer prior to molding the semiconductor device. Such coating may be performed by dipping, dripping or spraying the semiconductor device in or with a polymer solution.
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fullrecord <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_07329617</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>07329617</sourcerecordid><originalsourceid>FETCH-uspatents_grants_073296173</originalsourceid><addsrcrecordid>eNqNi0EKwjAQRbNxIdU7zAWEasHiuiiCW_cyJJM20MyUzsTza8ADuHr8x39b9xgELfEIUVYgnpB9XRgm0iQMEiHLHKrzkhcpHMAElHLywqF4-3aB3smT7twm4qy0_7FxcLs-h_uh6IJGbPoaV6xo--50OR_77o_LBzqVNrE</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Coating for enhancing adhesion of molding compound to semiconductor devices</title><source>USPTO Issued Patents</source><creator>Li, Jianxiong ; Chaw, Chi Chuen ; Tsui, Ngai Kin ; Liu, Deming ; Kwan, Yiu Fai ; Chan, Wai</creator><creatorcontrib>Li, Jianxiong ; Chaw, Chi Chuen ; Tsui, Ngai Kin ; Liu, Deming ; Kwan, Yiu Fai ; Chan, Wai ; ASM Assembly Automation Ltd</creatorcontrib><description>A method is provided for enhancing adhesion between a molding compound and a semiconductor device comprising a semiconductor chip attached on a carrier, such as a lead frame, by coating the semiconductor device with a polymer primer prior to molding the semiconductor device. Such coating may be performed by dipping, dripping or spraying the semiconductor device in or with a polymer solution.</description><language>eng</language><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7329617$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,777,799,882,64018</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7329617$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Li, Jianxiong</creatorcontrib><creatorcontrib>Chaw, Chi Chuen</creatorcontrib><creatorcontrib>Tsui, Ngai Kin</creatorcontrib><creatorcontrib>Liu, Deming</creatorcontrib><creatorcontrib>Kwan, Yiu Fai</creatorcontrib><creatorcontrib>Chan, Wai</creatorcontrib><creatorcontrib>ASM Assembly Automation Ltd</creatorcontrib><title>Coating for enhancing adhesion of molding compound to semiconductor devices</title><description>A method is provided for enhancing adhesion between a molding compound and a semiconductor device comprising a semiconductor chip attached on a carrier, such as a lead frame, by coating the semiconductor device with a polymer primer prior to molding the semiconductor device. Such coating may be performed by dipping, dripping or spraying the semiconductor device in or with a polymer solution.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2008</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNqNi0EKwjAQRbNxIdU7zAWEasHiuiiCW_cyJJM20MyUzsTza8ADuHr8x39b9xgELfEIUVYgnpB9XRgm0iQMEiHLHKrzkhcpHMAElHLywqF4-3aB3smT7twm4qy0_7FxcLs-h_uh6IJGbPoaV6xo--50OR_77o_LBzqVNrE</recordid><startdate>20080212</startdate><enddate>20080212</enddate><creator>Li, Jianxiong</creator><creator>Chaw, Chi Chuen</creator><creator>Tsui, Ngai Kin</creator><creator>Liu, Deming</creator><creator>Kwan, Yiu Fai</creator><creator>Chan, Wai</creator><scope>EFH</scope></search><sort><creationdate>20080212</creationdate><title>Coating for enhancing adhesion of molding compound to semiconductor devices</title><author>Li, Jianxiong ; Chaw, Chi Chuen ; Tsui, Ngai Kin ; Liu, Deming ; Kwan, Yiu Fai ; Chan, Wai</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_073296173</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2008</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Li, Jianxiong</creatorcontrib><creatorcontrib>Chaw, Chi Chuen</creatorcontrib><creatorcontrib>Tsui, Ngai Kin</creatorcontrib><creatorcontrib>Liu, Deming</creatorcontrib><creatorcontrib>Kwan, Yiu Fai</creatorcontrib><creatorcontrib>Chan, Wai</creatorcontrib><creatorcontrib>ASM Assembly Automation Ltd</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Li, Jianxiong</au><au>Chaw, Chi Chuen</au><au>Tsui, Ngai Kin</au><au>Liu, Deming</au><au>Kwan, Yiu Fai</au><au>Chan, Wai</au><aucorp>ASM Assembly Automation Ltd</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Coating for enhancing adhesion of molding compound to semiconductor devices</title><date>2008-02-12</date><risdate>2008</risdate><abstract>A method is provided for enhancing adhesion between a molding compound and a semiconductor device comprising a semiconductor chip attached on a carrier, such as a lead frame, by coating the semiconductor device with a polymer primer prior to molding the semiconductor device. Such coating may be performed by dipping, dripping or spraying the semiconductor device in or with a polymer solution.</abstract><oa>free_for_read</oa></addata></record>
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title Coating for enhancing adhesion of molding compound to semiconductor devices
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-19T16%3A42%3A39IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Li,%20Jianxiong&rft.aucorp=ASM%20Assembly%20Automation%20Ltd&rft.date=2008-02-12&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E07329617%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true