Integrated thin film capacitor/inductor/interconnect system and method
A system and method for the fabrication of high reliability capacitors, inductors, and multi-layer interconnects (including resistors) on various thin film hybrid substrate surfaces is disclosed. The disclosed method first employs a thin metal layer deposited and patterned on the substrate. This thi...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!