Adhesion by plasma conditioning of semiconductor chip

A plasma conditioning method of improving the adhesion between an integrated circuit chip, having active and passive surfaces, the active surface polymer-coated and having a plurality of electrical coupling members, and an insulating underfill material. The method comprises the steps of positioning...

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Hauptverfasser:	Cowens, Marvin W, Murtuza, Masood, Yamunan, Vinu, Odegard, Charles, Coffman, Phillip R
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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