Heating apparatus to heat wafers using water and plate with turbolators

Embodiments of the invention provide a fluid processing method and apparatus. The apparatus includes a substrate support assembly positioned in a processing volume, a disk shaped member positioned in the processing volume in parallel orientation with a substrate supported on the substrate support as...

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Bibliographische Detailangaben

Hauptverfasser:	Nguyen, Son T, Rosen, Gary J, Pancham, Ian A
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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