Integral cold plate/chasses housing applicable to force-cooled power electronics

Integral cold plate/chasses housing applicable to force-cooled power electronics

An integral cold plate/chassis (ICPC) housing may be formed from two blocks of material, having a cold plate sandwiched therebetween, brazed together. The blocks may then be machined to fit power electronics therein, thereby providing a cold plate as an integral part of the power electronic's h...

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Hauptverfasser: Ganev, Evgeni, Dietrich, Robert A, Quan, Michael A
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Sprache:eng
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creator Ganev, Evgeni
Dietrich, Robert A
Quan, Michael A
description An integral cold plate/chassis (ICPC) housing may be formed from two blocks of material, having a cold plate sandwiched therebetween, brazed together. The blocks may then be machined to fit power electronics therein, thereby providing a cold plate as an integral part of the power electronic's housing. Unlike conventional heat exchangers that may be used to dissipate heat from power-dissipating components that are housed typically in sheet metal housings, the ICPC described herein provides a cold plate integral to the housing of power electronics, thereby allowing the rapid and efficient removal of heat from the components into the cold plate carrier fluid and out of the system.
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The blocks may then be machined to fit power electronics therein, thereby providing a cold plate as an integral part of the power electronic's housing. Unlike conventional heat exchangers that may be used to dissipate heat from power-dissipating components that are housed typically in sheet metal housings, the ICPC described herein provides a cold plate integral to the housing of power electronics, thereby allowing the rapid and efficient removal of heat from the components into the cold plate carrier fluid and out of the system.</description><language>eng</language><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7295440$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,776,798,881,64015</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7295440$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Ganev, Evgeni</creatorcontrib><creatorcontrib>Dietrich, Robert A</creatorcontrib><creatorcontrib>Quan, Michael A</creatorcontrib><creatorcontrib>Honeywell International, Inc</creatorcontrib><title>Integral cold plate/chasses housing applicable to force-cooled power electronics</title><description>An integral cold plate/chassis (ICPC) housing may be formed from two blocks of material, having a cold plate sandwiched therebetween, brazed together. 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The blocks may then be machined to fit power electronics therein, thereby providing a cold plate as an integral part of the power electronic's housing. Unlike conventional heat exchangers that may be used to dissipate heat from power-dissipating components that are housed typically in sheet metal housings, the ICPC described herein provides a cold plate integral to the housing of power electronics, thereby allowing the rapid and efficient removal of heat from the components into the cold plate carrier fluid and out of the system.</abstract><oa>free_for_read</oa></addata></record>
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title Integral cold plate/chasses housing applicable to force-cooled power electronics
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