Chip-mounted film package
A chip-mounted film package includes a base film, an effective film package defined on the base film by a cutting line, a driving chip mounted on the effective film package, a plurality of input pads arranged on an input area of the effective film package and connected to the driving chip, and a plu...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | Kang, Sin Ho Aiin, Seung Kuk |
| description | A chip-mounted film package includes a base film, an effective film package defined on the base film by a cutting line, a driving chip mounted on the effective film package, a plurality of input pads arranged on an input area of the effective film package and connected to the driving chip, and a plurality of output pads arranged on an output area of the effective film package and connected to the driving chip, wherein the output area includes at least one extended portion that protrudes from a side of the effective film package in a horizontal direction of the base film. |
| format | Patent |
| fullrecord | <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_07288832</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>07288832</sourcerecordid><originalsourceid>FETCH-uspatents_grants_072888323</originalsourceid><addsrcrecordid>eNrjZJB0zsgs0M3NL80rSU1RSMvMyVUoSEzOTkxP5WFgTUvMKU7lhdLcDApuriHOHrqlxQWJJal5JcXx6UWJIMrA3MjCwsLYyJgIJQDwICNb</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Chip-mounted film package</title><source>USPTO Issued Patents</source><creator>Kang, Sin Ho ; Aiin, Seung Kuk</creator><creatorcontrib>Kang, Sin Ho ; Aiin, Seung Kuk ; L.G. Philips LCD Co., Ltd</creatorcontrib><description>A chip-mounted film package includes a base film, an effective film package defined on the base film by a cutting line, a driving chip mounted on the effective film package, a plurality of input pads arranged on an input area of the effective film package and connected to the driving chip, and a plurality of output pads arranged on an output area of the effective film package and connected to the driving chip, wherein the output area includes at least one extended portion that protrudes from a side of the effective film package in a horizontal direction of the base film.</description><language>eng</language><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7288832$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,780,802,885,64039</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7288832$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Kang, Sin Ho</creatorcontrib><creatorcontrib>Aiin, Seung Kuk</creatorcontrib><creatorcontrib>L.G. Philips LCD Co., Ltd</creatorcontrib><title>Chip-mounted film package</title><description>A chip-mounted film package includes a base film, an effective film package defined on the base film by a cutting line, a driving chip mounted on the effective film package, a plurality of input pads arranged on an input area of the effective film package and connected to the driving chip, and a plurality of output pads arranged on an output area of the effective film package and connected to the driving chip, wherein the output area includes at least one extended portion that protrudes from a side of the effective film package in a horizontal direction of the base film.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZJB0zsgs0M3NL80rSU1RSMvMyVUoSEzOTkxP5WFgTUvMKU7lhdLcDApuriHOHrqlxQWJJal5JcXx6UWJIMrA3MjCwsLYyJgIJQDwICNb</recordid><startdate>20071030</startdate><enddate>20071030</enddate><creator>Kang, Sin Ho</creator><creator>Aiin, Seung Kuk</creator><scope>EFH</scope></search><sort><creationdate>20071030</creationdate><title>Chip-mounted film package</title><author>Kang, Sin Ho ; Aiin, Seung Kuk</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_072888323</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Kang, Sin Ho</creatorcontrib><creatorcontrib>Aiin, Seung Kuk</creatorcontrib><creatorcontrib>L.G. Philips LCD Co., Ltd</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kang, Sin Ho</au><au>Aiin, Seung Kuk</au><aucorp>L.G. Philips LCD Co., Ltd</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Chip-mounted film package</title><date>2007-10-30</date><risdate>2007</risdate><abstract>A chip-mounted film package includes a base film, an effective film package defined on the base film by a cutting line, a driving chip mounted on the effective film package, a plurality of input pads arranged on an input area of the effective film package and connected to the driving chip, and a plurality of output pads arranged on an output area of the effective film package and connected to the driving chip, wherein the output area includes at least one extended portion that protrudes from a side of the effective film package in a horizontal direction of the base film.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_uspatents_grants_07288832 |
| source | USPTO Issued Patents |
| title | Chip-mounted film package |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-04T06%3A53%3A03IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Kang,%20Sin%20Ho&rft.aucorp=L.G.%20Philips%20LCD%20Co.,%20Ltd&rft.date=2007-10-30&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E07288832%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |