Device for testing thin elements
A device for testing thin elements, such as wafers or individual substrates, while at the same time offering a facility for inspecting the reverse side of the thin elements is provided in which any deflection of the substrate as a consequence of high contact power of the probe card is avoided and wh...
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creator | Beier, Uwe Runge, Dietmar Kreissig, Stefan Grauer, Steffen Rottka, Matthias Hirschfeld, Botho Kiesewetter, Joerg |
description | A device for testing thin elements, such as wafers or individual substrates, while at the same time offering a facility for inspecting the reverse side of the thin elements is provided in which any deflection of the substrate as a consequence of high contact power of the probe card is avoided and which is also suitable for substrate diameters of 200 mm and above. The device includes a stable plate with a central opening positioned on the basic construction, a frame which can be moved and/or turned on the plate in an x/y direction and, if required, in a theta direction, a highly-rigid substrate support which can be mounted in the frame, and substrates which can be mounted on the substrate support, wherein the mounting is effected through a vacuum, using mechanical elements (clamping ring, clamping foil or other suitable clamping elements), gel pack pads, or adhesive etc. |
format | Patent |
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The device includes a stable plate with a central opening positioned on the basic construction, a frame which can be moved and/or turned on the plate in an x/y direction and, if required, in a theta direction, a highly-rigid substrate support which can be mounted in the frame, and substrates which can be mounted on the substrate support, wherein the mounting is effected through a vacuum, using mechanical elements (clamping ring, clamping foil or other suitable clamping elements), gel pack pads, or adhesive etc.</description><language>eng</language><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7282930$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,309,781,803,886,64044</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7282930$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Beier, Uwe</creatorcontrib><creatorcontrib>Runge, Dietmar</creatorcontrib><creatorcontrib>Kreissig, Stefan</creatorcontrib><creatorcontrib>Grauer, Steffen</creatorcontrib><creatorcontrib>Rottka, Matthias</creatorcontrib><creatorcontrib>Hirschfeld, Botho</creatorcontrib><creatorcontrib>Kiesewetter, Joerg</creatorcontrib><creatorcontrib>Suss Microtec Test Systems GmbH</creatorcontrib><title>Device for testing thin elements</title><description>A device for testing thin elements, such as wafers or individual substrates, while at the same time offering a facility for inspecting the reverse side of the thin elements is provided in which any deflection of the substrate as a consequence of high contact power of the probe card is avoided and which is also suitable for substrate diameters of 200 mm and above. The device includes a stable plate with a central opening positioned on the basic construction, a frame which can be moved and/or turned on the plate in an x/y direction and, if required, in a theta direction, a highly-rigid substrate support which can be mounted in the frame, and substrates which can be mounted on the substrate support, wherein the mounting is effected through a vacuum, using mechanical elements (clamping ring, clamping foil or other suitable clamping elements), gel pack pads, or adhesive etc.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZFBwSS3LTE5VSMsvUihJLS7JzEtXKMnIzFNIzUnNTc0rKeZhYE1LzClO5YXS3AwKbq4hzh66pcUFiSUgFfHpRYkgysDcyMLI0tjAmAglACuyJhg</recordid><startdate>20071016</startdate><enddate>20071016</enddate><creator>Beier, Uwe</creator><creator>Runge, Dietmar</creator><creator>Kreissig, Stefan</creator><creator>Grauer, Steffen</creator><creator>Rottka, Matthias</creator><creator>Hirschfeld, Botho</creator><creator>Kiesewetter, Joerg</creator><scope>EFH</scope></search><sort><creationdate>20071016</creationdate><title>Device for testing thin elements</title><author>Beier, Uwe ; Runge, Dietmar ; Kreissig, Stefan ; Grauer, Steffen ; Rottka, Matthias ; Hirschfeld, Botho ; Kiesewetter, Joerg</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_072829303</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Beier, Uwe</creatorcontrib><creatorcontrib>Runge, Dietmar</creatorcontrib><creatorcontrib>Kreissig, Stefan</creatorcontrib><creatorcontrib>Grauer, Steffen</creatorcontrib><creatorcontrib>Rottka, Matthias</creatorcontrib><creatorcontrib>Hirschfeld, Botho</creatorcontrib><creatorcontrib>Kiesewetter, Joerg</creatorcontrib><creatorcontrib>Suss Microtec Test Systems GmbH</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Beier, Uwe</au><au>Runge, Dietmar</au><au>Kreissig, Stefan</au><au>Grauer, Steffen</au><au>Rottka, Matthias</au><au>Hirschfeld, Botho</au><au>Kiesewetter, Joerg</au><aucorp>Suss Microtec Test Systems GmbH</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Device for testing thin elements</title><date>2007-10-16</date><risdate>2007</risdate><abstract>A device for testing thin elements, such as wafers or individual substrates, while at the same time offering a facility for inspecting the reverse side of the thin elements is provided in which any deflection of the substrate as a consequence of high contact power of the probe card is avoided and which is also suitable for substrate diameters of 200 mm and above. The device includes a stable plate with a central opening positioned on the basic construction, a frame which can be moved and/or turned on the plate in an x/y direction and, if required, in a theta direction, a highly-rigid substrate support which can be mounted in the frame, and substrates which can be mounted on the substrate support, wherein the mounting is effected through a vacuum, using mechanical elements (clamping ring, clamping foil or other suitable clamping elements), gel pack pads, or adhesive etc.</abstract><oa>free_for_read</oa></addata></record> |
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title | Device for testing thin elements |
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