Semiconductor device cooling apparatus
In a semiconductor device cooling apparatus which cools a semiconductor device uniformly with a simple structure, a coolant is supplied from a supply port to the center of a heat transmission plate on which a semiconductor device is disposed in intimate contact therewith, is radially flown toward th...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | eng |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | Fujisaki, Akihiko |
description | In a semiconductor device cooling apparatus which cools a semiconductor device uniformly with a simple structure, a coolant is supplied from a supply port to the center of a heat transmission plate on which a semiconductor device is disposed in intimate contact therewith, is radially flown toward the peripheral edge portion of the heat transmission plate through a gap-shaped flow path which is formed by a gap forming plate composed of two thin plate members of a gap interval plate acting as a spacer and a gap top plate disposed on the gap interval plate and has a small height, is collected by a collection groove formed around the peripheral edge portion, and is discharged from a discharge port. |
format | Patent |
fullrecord | <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_07278466</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>07278466</sourcerecordid><originalsourceid>FETCH-uspatents_grants_072784663</originalsourceid><addsrcrecordid>eNrjZFALTs3NTM7PSylNLskvUkhJLctMTlVIzs_PycxLV0gsKEgsSiwpLeZhYE1LzClO5YXS3AwKbq4hzh66pcUFiSWpeSXF8elFiSDKwNzI3MLEzMyYCCUAfTso9g</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Semiconductor device cooling apparatus</title><source>USPTO Issued Patents</source><creator>Fujisaki, Akihiko</creator><creatorcontrib>Fujisaki, Akihiko ; Fujitsu Limited</creatorcontrib><description>In a semiconductor device cooling apparatus which cools a semiconductor device uniformly with a simple structure, a coolant is supplied from a supply port to the center of a heat transmission plate on which a semiconductor device is disposed in intimate contact therewith, is radially flown toward the peripheral edge portion of the heat transmission plate through a gap-shaped flow path which is formed by a gap forming plate composed of two thin plate members of a gap interval plate acting as a spacer and a gap top plate disposed on the gap interval plate and has a small height, is collected by a collection groove formed around the peripheral edge portion, and is discharged from a discharge port.</description><language>eng</language><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7278466$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,776,798,881,64012</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7278466$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Fujisaki, Akihiko</creatorcontrib><creatorcontrib>Fujitsu Limited</creatorcontrib><title>Semiconductor device cooling apparatus</title><description>In a semiconductor device cooling apparatus which cools a semiconductor device uniformly with a simple structure, a coolant is supplied from a supply port to the center of a heat transmission plate on which a semiconductor device is disposed in intimate contact therewith, is radially flown toward the peripheral edge portion of the heat transmission plate through a gap-shaped flow path which is formed by a gap forming plate composed of two thin plate members of a gap interval plate acting as a spacer and a gap top plate disposed on the gap interval plate and has a small height, is collected by a collection groove formed around the peripheral edge portion, and is discharged from a discharge port.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZFALTs3NTM7PSylNLskvUkhJLctMTlVIzs_PycxLV0gsKEgsSiwpLeZhYE1LzClO5YXS3AwKbq4hzh66pcUFiSWpeSXF8elFiSDKwNzI3MLEzMyYCCUAfTso9g</recordid><startdate>20071009</startdate><enddate>20071009</enddate><creator>Fujisaki, Akihiko</creator><scope>EFH</scope></search><sort><creationdate>20071009</creationdate><title>Semiconductor device cooling apparatus</title><author>Fujisaki, Akihiko</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_072784663</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Fujisaki, Akihiko</creatorcontrib><creatorcontrib>Fujitsu Limited</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Fujisaki, Akihiko</au><aucorp>Fujitsu Limited</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Semiconductor device cooling apparatus</title><date>2007-10-09</date><risdate>2007</risdate><abstract>In a semiconductor device cooling apparatus which cools a semiconductor device uniformly with a simple structure, a coolant is supplied from a supply port to the center of a heat transmission plate on which a semiconductor device is disposed in intimate contact therewith, is radially flown toward the peripheral edge portion of the heat transmission plate through a gap-shaped flow path which is formed by a gap forming plate composed of two thin plate members of a gap interval plate acting as a spacer and a gap top plate disposed on the gap interval plate and has a small height, is collected by a collection groove formed around the peripheral edge portion, and is discharged from a discharge port.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_uspatents_grants_07278466 |
source | USPTO Issued Patents |
title | Semiconductor device cooling apparatus |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-08T20%3A23%3A03IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Fujisaki,%20Akihiko&rft.aucorp=Fujitsu%20Limited&rft.date=2007-10-09&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E07278466%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |