Low cost bonding pad and method of fabricating same

A structure and a method of forming the structure. The structure including: an integrated circuit chip having a set of wiring levels from a first wiring level to a last wiring level, each wiring level including one or more damascene, dual-damascene wires or damascene vias embedded in corresponding i...

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Bibliographische Detailangaben

Hauptverfasser:	Brigante, Jeffrey Alan, He, Zhong-Xiang, Waterhouse, Barbara Ann, White, Eric Jeffrey
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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