Sheet-like board member and method of manufacturing a semiconductor device

In the present invention there is formed a sheet-like board member having conductive coating films, such as first pads and die pads , formed thereon or a sheet-like board member which has been half-etched by using conductive coating films such as first pads and die pads . A hybrid IC can be manufact...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Sakamoto, Noriaki, Kobayashi, Yoshiyuki, Sakamoto, Junji, Mashimo, Shigeaki, Okawa, Katsumi, Maehara, Eiju, Takahashi, Kouji
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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