Electroplated CoWP composite structures as copper barrier layers

A composite material comprising a layer containing copper, and an electrodeposited CoWP film on the copper layer. The CoWP film contains from 11 atom percent to 25 atom percent phosphorus and has a thickness from 5 nm to 200 nm. The invention is also directed to a method of making an interconnect st...

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Bibliographische Detailangaben

Hauptverfasser:	Cabral, Jr, Cyril, Chiras, Stefanie R, Cooper, Emanuel I, Deligianni, Hariklia, Kellock, Andrew J, Rubino, Judith M, Tsai, Roger Y
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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