Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board

An apparatus is provided for packaging a laminated capacitor made to have a low ESL value and is used for a decoupling capacitor to be connected to a power supply circuit for a MPU chip providing a MPU. The laminated capacitor is accommodated within a cavity provided on a wiring board. The capacitor...

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Bibliographische Detailangaben

Hauptverfasser:	Naito, Yasuyuki, Taniguchi, Masaaki, Kuroda, Yoichi, Hori, Haruo, Kondo, Takanori
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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