Contactless circuit testing for adaptive wafer processing

Contactless circuit testing for adaptive wafer processing

A system and method for measuring circuits on an integrated circuit substrate includes a measurement circuit formed on the integrated circuit substrate that measures at least one characteristic of an integrated circuit. The measurement circuit has a power transfer device including a power transfer c...

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1. Verfasser: Kwark, Young Hoon
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creator Kwark, Young Hoon
description A system and method for measuring circuits on an integrated circuit substrate includes a measurement circuit formed on the integrated circuit substrate that measures at least one characteristic of an integrated circuit. The measurement circuit has a power transfer device including a power transfer component, which receives energy from a source where the source does not make physical contact with the integrated circuit substrate to transfer power to the measurement circuit. Measurements are taken to provide feedback for in-situ adjustments to circuit parameters and responses.
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fullrecord <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_07215133</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>07215133</sourcerecordid><originalsourceid>FETCH-uspatents_grants_072151333</originalsourceid><addsrcrecordid>eNrjZLB0zs8rSUwuyUktLlZIzixKLs0sUShJLS7JzEtXSMsvUkhMSSwoySxLVShPTEstUigoyk8GKgXK8jCwpiXmFKfyQmluBgU31xBnD93S4oLEktS8kuL49KJEEGVgbmRoamhsbEyEEgBQrjAV</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Contactless circuit testing for adaptive wafer processing</title><source>USPTO Issued Patents</source><creator>Kwark, Young Hoon</creator><creatorcontrib>Kwark, Young Hoon ; International Business Machines Corporation</creatorcontrib><description>A system and method for measuring circuits on an integrated circuit substrate includes a measurement circuit formed on the integrated circuit substrate that measures at least one characteristic of an integrated circuit. The measurement circuit has a power transfer device including a power transfer component, which receives energy from a source where the source does not make physical contact with the integrated circuit substrate to transfer power to the measurement circuit. Measurements are taken to provide feedback for in-situ adjustments to circuit parameters and responses.</description><language>eng</language><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7215133$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,776,798,881,64015</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7215133$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Kwark, Young Hoon</creatorcontrib><creatorcontrib>International Business Machines Corporation</creatorcontrib><title>Contactless circuit testing for adaptive wafer processing</title><description>A system and method for measuring circuits on an integrated circuit substrate includes a measurement circuit formed on the integrated circuit substrate that measures at least one characteristic of an integrated circuit. The measurement circuit has a power transfer device including a power transfer component, which receives energy from a source where the source does not make physical contact with the integrated circuit substrate to transfer power to the measurement circuit. Measurements are taken to provide feedback for in-situ adjustments to circuit parameters and responses.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZLB0zs8rSUwuyUktLlZIzixKLs0sUShJLS7JzEtXSMsvUkhMSSwoySxLVShPTEstUigoyk8GKgXK8jCwpiXmFKfyQmluBgU31xBnD93S4oLEktS8kuL49KJEEGVgbmRoamhsbEyEEgBQrjAV</recordid><startdate>20070508</startdate><enddate>20070508</enddate><creator>Kwark, Young Hoon</creator><scope>EFH</scope></search><sort><creationdate>20070508</creationdate><title>Contactless circuit testing for adaptive wafer processing</title><author>Kwark, Young Hoon</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_072151333</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Kwark, Young Hoon</creatorcontrib><creatorcontrib>International Business Machines Corporation</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kwark, Young Hoon</au><aucorp>International Business Machines Corporation</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Contactless circuit testing for adaptive wafer processing</title><date>2007-05-08</date><risdate>2007</risdate><abstract>A system and method for measuring circuits on an integrated circuit substrate includes a measurement circuit formed on the integrated circuit substrate that measures at least one characteristic of an integrated circuit. The measurement circuit has a power transfer device including a power transfer component, which receives energy from a source where the source does not make physical contact with the integrated circuit substrate to transfer power to the measurement circuit. Measurements are taken to provide feedback for in-situ adjustments to circuit parameters and responses.</abstract><oa>free_for_read</oa></addata></record>
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title Contactless circuit testing for adaptive wafer processing
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-26T03%3A57%3A40IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Kwark,%20Young%20Hoon&rft.aucorp=International%20Business%20Machines%20Corporation&rft.date=2007-05-08&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E07215133%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true