Circuit board and its manufacturing method
A circuit board is provided in which peeling strength is prevented from decreasing and a connection resistance to a conductive material is prevented from increasing, though the contact area decreases when the circuit board has a copper foil. This circuit board has a metal film for covering a through...
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| creator | Sugawa, Toshio Takase, Yoshihisa |
| description | A circuit board is provided in which peeling strength is prevented from decreasing and a connection resistance to a conductive material is prevented from increasing, though the contact area decreases when the circuit board has a copper foil. This circuit board has a metal film for covering a through hole on at least one surface of an insulating substrate having the through hole filled with the conductive material. An uneven layer with a thickness of 5 μm or more is formed on a surface of the metal film, and a metal layer is formed on the opposite surface to the uneven layer. |
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| language | eng |
| recordid | cdi_uspatents_grants_07197820 |
| source | USPTO Issued Patents |
| title | Circuit board and its manufacturing method |
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