Electronic component placement machine having camera units with vertically overlaid apertures

An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a chip from a feeder and flips it. A placement head receives the flipped chip and places it onto a board....

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Hauptverfasser: Noda, Kazuhiko, Mukojima, Hitoshi, Narikiyo, Yasuhiro, Hirakawa, Toshiro, Kanaki, Hiromi, Nishimura, Akira, Uchida, Osamu, Ishikawa, Takatoshi
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Sprache:eng
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creator Noda, Kazuhiko
Mukojima, Hitoshi
Narikiyo, Yasuhiro
Hirakawa, Toshiro
Kanaki, Hiromi
Nishimura, Akira
Uchida, Osamu
Ishikawa, Takatoshi
description An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a chip from a feeder and flips it. A placement head receives the flipped chip and places it onto a board. An image of the chip at a pre-centering recognition position is captured during a takeout and transfer operation, during which the takeout and transfer head transfers the chip to the placement head at a receiving position, so as to recognize the position. Based on this positional recognition result, the chip and the placement head are positioned by controlling a placement head driving mechanism. Moreover, the takeout and transfer head is rotated to a position which does not hinder image capturing of the electronic component for placement positioning.
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title Electronic component placement machine having camera units with vertically overlaid apertures
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