Electronic component placement machine having camera units with vertically overlaid apertures
An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a chip from a feeder and flips it. A placement head receives the flipped chip and places it onto a board....
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creator | Noda, Kazuhiko Mukojima, Hitoshi Narikiyo, Yasuhiro Hirakawa, Toshiro Kanaki, Hiromi Nishimura, Akira Uchida, Osamu Ishikawa, Takatoshi |
description | An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a chip from a feeder and flips it. A placement head receives the flipped chip and places it onto a board. An image of the chip at a pre-centering recognition position is captured during a takeout and transfer operation, during which the takeout and transfer head transfers the chip to the placement head at a receiving position, so as to recognize the position. Based on this positional recognition result, the chip and the placement head are positioned by controlling a placement head driving mechanism. Moreover, the takeout and transfer head is rotated to a position which does not hinder image capturing of the electronic component for placement positioning. |
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fullrecord | <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_07191511</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>07191511</sourcerecordid><originalsourceid>FETCH-uspatents_grants_071915113</originalsourceid><addsrcrecordid>eNqNjEsKAkEMBXvjQtQ75AKCjYi4lhEP4FYkxDgdSH_oz4i3twc8gKsqHsVbmvugTDXHIAQUfYqBQ4WkSOxn80hOAoPDScIIhJ4zQgtSC7ylOpg4VyFU_UDsrihPwNTHlrmszeKFWnjz48rAZbidr9tWEtb-Xx5jxhm7oz3Zg7X7P5IvKI8-Eg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Electronic component placement machine having camera units with vertically overlaid apertures</title><source>USPTO Issued Patents</source><creator>Noda, Kazuhiko ; Mukojima, Hitoshi ; Narikiyo, Yasuhiro ; Hirakawa, Toshiro ; Kanaki, Hiromi ; Nishimura, Akira ; Uchida, Osamu ; Ishikawa, Takatoshi</creator><creatorcontrib>Noda, Kazuhiko ; Mukojima, Hitoshi ; Narikiyo, Yasuhiro ; Hirakawa, Toshiro ; Kanaki, Hiromi ; Nishimura, Akira ; Uchida, Osamu ; Ishikawa, Takatoshi ; Matsushita Electric Industrial Co., Ltd</creatorcontrib><description>An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a chip from a feeder and flips it. A placement head receives the flipped chip and places it onto a board. An image of the chip at a pre-centering recognition position is captured during a takeout and transfer operation, during which the takeout and transfer head transfers the chip to the placement head at a receiving position, so as to recognize the position. Based on this positional recognition result, the chip and the placement head are positioned by controlling a placement head driving mechanism. Moreover, the takeout and transfer head is rotated to a position which does not hinder image capturing of the electronic component for placement positioning.</description><language>eng</language><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7191511$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,780,802,885,64039</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7191511$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Noda, Kazuhiko</creatorcontrib><creatorcontrib>Mukojima, Hitoshi</creatorcontrib><creatorcontrib>Narikiyo, Yasuhiro</creatorcontrib><creatorcontrib>Hirakawa, Toshiro</creatorcontrib><creatorcontrib>Kanaki, Hiromi</creatorcontrib><creatorcontrib>Nishimura, Akira</creatorcontrib><creatorcontrib>Uchida, Osamu</creatorcontrib><creatorcontrib>Ishikawa, Takatoshi</creatorcontrib><creatorcontrib>Matsushita Electric Industrial Co., Ltd</creatorcontrib><title>Electronic component placement machine having camera units with vertically overlaid apertures</title><description>An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a chip from a feeder and flips it. A placement head receives the flipped chip and places it onto a board. An image of the chip at a pre-centering recognition position is captured during a takeout and transfer operation, during which the takeout and transfer head transfers the chip to the placement head at a receiving position, so as to recognize the position. Based on this positional recognition result, the chip and the placement head are positioned by controlling a placement head driving mechanism. Moreover, the takeout and transfer head is rotated to a position which does not hinder image capturing of the electronic component for placement positioning.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNqNjEsKAkEMBXvjQtQ75AKCjYi4lhEP4FYkxDgdSH_oz4i3twc8gKsqHsVbmvugTDXHIAQUfYqBQ4WkSOxn80hOAoPDScIIhJ4zQgtSC7ylOpg4VyFU_UDsrihPwNTHlrmszeKFWnjz48rAZbidr9tWEtb-Xx5jxhm7oz3Zg7X7P5IvKI8-Eg</recordid><startdate>20070320</startdate><enddate>20070320</enddate><creator>Noda, Kazuhiko</creator><creator>Mukojima, Hitoshi</creator><creator>Narikiyo, Yasuhiro</creator><creator>Hirakawa, Toshiro</creator><creator>Kanaki, Hiromi</creator><creator>Nishimura, Akira</creator><creator>Uchida, Osamu</creator><creator>Ishikawa, Takatoshi</creator><scope>EFH</scope></search><sort><creationdate>20070320</creationdate><title>Electronic component placement machine having camera units with vertically overlaid apertures</title><author>Noda, Kazuhiko ; Mukojima, Hitoshi ; Narikiyo, Yasuhiro ; Hirakawa, Toshiro ; Kanaki, Hiromi ; Nishimura, Akira ; Uchida, Osamu ; Ishikawa, Takatoshi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_071915113</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Noda, Kazuhiko</creatorcontrib><creatorcontrib>Mukojima, Hitoshi</creatorcontrib><creatorcontrib>Narikiyo, Yasuhiro</creatorcontrib><creatorcontrib>Hirakawa, Toshiro</creatorcontrib><creatorcontrib>Kanaki, Hiromi</creatorcontrib><creatorcontrib>Nishimura, Akira</creatorcontrib><creatorcontrib>Uchida, Osamu</creatorcontrib><creatorcontrib>Ishikawa, Takatoshi</creatorcontrib><creatorcontrib>Matsushita Electric Industrial Co., Ltd</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Noda, Kazuhiko</au><au>Mukojima, Hitoshi</au><au>Narikiyo, Yasuhiro</au><au>Hirakawa, Toshiro</au><au>Kanaki, Hiromi</au><au>Nishimura, Akira</au><au>Uchida, Osamu</au><au>Ishikawa, Takatoshi</au><aucorp>Matsushita Electric Industrial Co., Ltd</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electronic component placement machine having camera units with vertically overlaid apertures</title><date>2007-03-20</date><risdate>2007</risdate><abstract>An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a chip from a feeder and flips it. A placement head receives the flipped chip and places it onto a board. An image of the chip at a pre-centering recognition position is captured during a takeout and transfer operation, during which the takeout and transfer head transfers the chip to the placement head at a receiving position, so as to recognize the position. Based on this positional recognition result, the chip and the placement head are positioned by controlling a placement head driving mechanism. Moreover, the takeout and transfer head is rotated to a position which does not hinder image capturing of the electronic component for placement positioning.</abstract><oa>free_for_read</oa></addata></record> |
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title | Electronic component placement machine having camera units with vertically overlaid apertures |
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