Method and apparatus for low temperature copper to copper bonding
A method comprising: coating a conductive bump on a first substrate with a conductive material to form a coated conductive bump; coating a conductive bump on a second substrate with a conductive material to form a coated conductive bump; and bonding the coated conductive bump on the first substrate...
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| creator | Ramanathan, Shriram Kim, Sarah E |
| description | A method comprising: coating a conductive bump on a first substrate with a conductive material to form a coated conductive bump; coating a conductive bump on a second substrate with a conductive material to form a coated conductive bump; and bonding the coated conductive bump on the first substrate to the coated conductive bump on the second substrate to electrically connect the first substrate to the second substrate. |
| format | Patent |
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| language | eng |
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| source | USPTO Issued Patents |
| title | Method and apparatus for low temperature copper to copper bonding |
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